New Generation RF AP Plasma Source: “Hi-Z HEAD”
Overcome the limitations of AP plasma source by mounting the Impedance Booster
The industry’s first integration of AP plasma equipment integrated with RF matching module
Guaranteed full compatibility and reliability with existing YOUNGSIN-RF’s RF equipment.
Breakthrough dual plasma technology simplifies equipment and lowers costs
Wide range of effective range products from 100mm to 1500mm
High Reliability
RF Plasma with 30 years of know-how in the semiconductor field.
Impedance boosting function developed by our own technology provides smooth RF power supply and minimizes heat generation.
Guaranteed perfect compatibility and reliability with existing YOUNGSIN-RF equipment.
Simplification of the production process
Industry’s first AP plasma source with integrated AP plasma source and RF matching equipment.
Breakthrough dual plasma technology simplifies equipment and accelerates plasma processing.
Wide range of effective range products from 100mm to 1500mm.
Reasonable Price
Reduced facility implementation and maintenance costs with RF matching equipment integration and dual plasma technology.
Customizing AP plasma source according to process environment.
Reduced overall process costs with RF AP plasma packaged products.
“Hi-Z HEAD: High Impedance.”
The all-new RF AP plasma source “Hi-Z HEAD” will overcome the limitations of
existing AP plasma and become a good partner for customers.
TYPE 1) Hi-Z HEAD : Impedance Booster
“Hi-Z HEAD” with its proprietary impedance boost function. Experience maximum RF output performance and dramatic heat improvements.
Significantly improves heat generation and prevents chronic RF cable burnout
Various plasma effective ranges from 100mm to 1500mm
Dual plasma technology and even gas injection
TYPE 2) Hi-Z HEAD : Integrated with RF matching
Maximize your process efficiency by integrating the AP plasma source with RF matching network.
Integrates the industry’s first RF matching equipment with an AP plasma source.
Free from RF cable lengths and simplify the process
Cost savings through streamlined device configuration